Principal Investigator of NSF funded project and co-Principal Investigator of DoD funded projects. Total funding received from NSF and DoD over 2 millions.
Experienced in finite element modeling and analysis (FEA) in different area, for example automotive parts, crash-worthiness of bumper, reliability analysis of electronic packages
Having 10+ years experience in mechanical tests to characterize different material/alloys like polyurethane foam, composite materials, lead-free solder alloys. Expert in tensile test, creep test, fatigue test (uniaxial and shear), drop/impact test, flexural test (three point bending); Prepare specimens and test matrix to perform these tests
Constitutive model (analytical) of lead free solder alloys, flexible composite and polyurethane foam
Microstructural characterization of different alloys by SEM, Optical microscope figure
Thermal cycling analysis of different electronic packages to determine the thermal fatigue life
Fabrication of composite materials by VRTM process
Laboratory instrument proficiency: Micro Tension-torsion tester, Instron Machine, Instron Dynatab, Scanning Electron Microscope (SEM), Optical Microscope, Reflow Oven, Thermal Cycling Chamber, X-ray Inspection, 9250HV Drop tower, Dage 4000 shear tool